With the continuous penetration of the Internet of things, the Internet of everything is gradually becoming a reality. In our daily life, all kinds of smart home devices can be connected To the same network, and the tren...

Highly integrated power management、Charging、AC/DC the power conversion、Wi-FiAnd Bluetooth low energy technology vendorsDialogSemiconductor company(German stock exchange trading code：DLG)Announced today，It is the smallest...

Recently, the news of the American Summit supercalculation has once again triggered the super competition between China and the United States, but in the new generation of hundreds of billions of overrun competitions, Japan is also an incapable opponent besides China and the United States. In recent years, the Fujitsu Corporation has been developing "Beijing" in cooperation with the Japanese Institute of science and chemical research. The successor can reach 10 billion times, which is 100 times that of Beijing, but its energy consumption is only about three times that of Beijing. Today, Fujitsu announced that the new generation of supercomputing has completed the prototype development of CPU and is carrying out functional testing.

Keyssa, a leader in contactless connectivity solutions, today introduced the KSS104M, a new generation of component connector products, in an ultra-compact 3 x 3mm package with improved electrical and mechanical tolerances for easier design, significantly reduced power consumption and support High-speed communication protocol for industry standards. Keyssa also publishes KSS104M-CW (Connected World), which is a ready-to-use non-contact connection module that includes all the electromagnetic and mechanical requirements of critical systems, enabling the KSS104M to be built into mobile devices and other system products.

Toshiba Semiconductor and Storage Products announced two new "TC3567CFSG" and "TC3567DFSG" leading industry [1] to achieve lower current consumption than the plateau [2] and enhance the safety communication function. These two ICs are Toshiba's latest members of Bluetooth-enabled low power (LE) [3] ver.4.2 communication chips. The sample is available.