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Global Smartphone Sales Declined In The First Quarter, With Only Apple And Samsung Growing, Supporting The Performance Of Hon Hai And LarganSource：爱集微 Release Date：2026/4/16 Click On：419According to the latest data from market research firm IDC, the global smartphone market declined for the first time since 2023 in the first quarter of this year. Tight storage supply and the impact of the war in Iran ha...
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Samsung Electro-Mechanics Plans To Set Up An MLCC Embedded Substrate Production Line In Vietnam To Expand AI Packaging Production CapacitySource：爱集微 Release Date：2026/4/15 Click On：440As AI chips have increasingly higher requirements for performance and integration, advanced packaging and substrate technologies have become crucial in semiconductor competition.Samsung Electro-Mechanics is reportedly bu...
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AI Reasoning Chip Stimulates A New Round Of Application InnovationSource：中国日报网 Release Date：2025/1/20 Click On：2188With the birth of ChatGPT, competition in the field of artificial intelligence (AI) has entered the same heat.Nvidias high -end graphic processing unit (GPU) chip is fluttered by major technology companies.At the same ti...
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Openai's Latest Model O3 Shows Strong Reasoning CapabilitiesSource： Release Date：2024/12/27 Click On：2300On December 20, the Open Artificial Intelligence Research Center (OpenAI) introduced its latest artificial intelligence (AI) reasoning model-O3 and its lightweight version of O3-Mini.The company claims that O3 has more a...
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Advanced packaging capacity in 2024 is expected to increase by 30 % to 40 %Source： Release Date：2024/1/5 Click On：61According to the TrendForce Ji State Consultation Research, in 2023, Chatbot and other generation AI applications have driven the growth boom of AI servers, and they are the most active investment in large cloud operator...
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The demand for the artificial intelligence market continues to improve, wafer foundry manufacturers urgently expand COWOS advanced packaging capacitySource： Release Date：2024/1/5 Click On：70Benefiting from the growth of the generation artificial intelligence application market, TSMC -related orders have continued to be popular with the development of artificial intelligence chips in various cloud computing...
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The production capacity of mature mainland China accounts for about 29%. It is estimated that 2027 will be expanded to 33%Source： Release Date：2024/1/5 Click On：69according toTrendForce Ji State Consultation Statistics, 2023 ~ 2027 Global Workers' mature process (28nm and above) and advanced processes (16nm and below) have remained at about 7: 3.Due to the efforts to promote local...
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The world's first 100mm diamond wafer appearedSource： Release Date：2024/1/5 Click On：37Recently, the headquarters is located in San Francisco, CaliforniaDiamondfoundryin announced the manufacture of single -crystal diamond wafer with a diameter of 100 mm in the world.The company plans to provide diamond -b...
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If the progress is not smooth, it is said that Apple will terminate the self -developed 5G baseband chipSource： Release Date：2024/1/5 Click On：82Apple self -developedThe 5G baseband chip has been 5 years, but it has encountered many obstacles in its research and development process. It originally hoped that it would be impossible to achieve a self -modem chip tar...
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"Profit" and "disadvantages" of solid capacitorsSource： Release Date：2024/1/5 Click On：58The electrical substance of the liquid electrolytic capacitor is liquid electrolyte. The liquid particles are very active at high temperatures, which causes pressure on the inside of the capacitor. Its boiling point is n...
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