About the common sense of packaging of IC products

closeICCommon sense of product packaging

one, What is packaging 

Packaging means to pipe the circuit foot on the silicon wafer,Use a wire to attract to the external connector,In order to connect to other devices.The form of packaging refers to the shell for installing the semiconductor integrated circuit chip.It not only plays the role of installation, fixing, sealing, protecting chips and enhancing electrical properties, but also connects to the pin of the packaging shell through the connection on the chip.Connect to other devices to achieve connection between internal chips and external circuits.Because the chip must be isolated from the outside world to prevent the electrical performance decreased by the corrosion of the impurities in the air to the corrosion of the chip circuit.On the other hand, the encapsulated chip is also easier to install and transport.Because the quality of the packaging technology also directly affects the performance of the chip's own performance and connecting itPCB(Printed circuit board)Design and manufacturing, so it is crucial. 

The important indicator of measuring the advanced chip packaging technology is the ratio of the chip area to the packaging area. The closer this ratio1The better.Main factors to consider when encapsulation: 

1The ratio of the chip area to the packaging area is to improve the packaging efficiency, as close as possible1：1； 

2The pins should be as short as possible to reduce delay, and the distance between the pins should be as far as possible to ensure that they do not interfere with each other and improve performance; 

3, Based on the requirements of heat dissipation, the thinner the package, the better. 

The package is mainly divided intoDIPDouble column direct insertion andSMDThere are two types of patch packaging.From the perspective of the structure, the packaging has gone through the earliest crystal tubeTO(likeTO-89、TO92) The packaging developed to the dual -column direct packaging, and thenPHILIPThe company developedSOPSmall appearance encapsulation, and gradually derives in the futureSOJ（JType pins small shape packaging),TSOP(Small small shape packaging),VSOP(Very small shape encapsulation),SSOPNarrowSOP）、TSSOP(Thin reductionSOP)andSOT(Small shape transistor),SOIC(Small shape integrated circuit) and so on.In terms of material medium, there are currently many metal packaging, including metal, ceramics, plastics, and plastics. At present, there are still a large number of metal packaging of many high -intensity working conditions such as JUN Gong and Aerospace. 

The packaging has gone through the following development process: 

Structure:TO－>DIP－>PLCC－>QFP－>BGA －>CSP； 

In terms of materials: metal, ceramics->Ceramics, Plastic->plastic; 

Spinning shape: long -drawing direct plug-->Short -drawing or non -lead stickers->Ballical convex point; 

Overcoming method: Tongkou plugging ->Surface assembly->Install directly 

two, Specific encapsulation form 

1、 SOP/SOICEncapsulate 

SOPIt's EnglishSmall Outline Package The abbreviation, that is, the small shape is encapsulated.SOPPacking technology1968～1969In the year, the Philip company was successfully developed, and it will gradually be assigned in the future.SOJ（JType pins small shape packaging),TSOP(Small small shape packaging),VSOP(Very small shape encapsulation),SSOPNarrowSOP）、TSSOP(Thin reductionSOP)andSOT(Small shape transistor),SOIC(Small shape integrated circuit) and so on. 

2、 DIPEncapsulate 

DIPIt's EnglishDouble In-line PackageThe abbreviations, that is, dual -column direct -inserted packaging.One of the packaged packaging, the pins are led from the sides of the packaging, and the packaging materials include plastic and ceramic.DIPIt is the most popular installation package, and the application scope includes standard logicIC, ModernLSI, Microcarmark, etc. 

3、 PLCCEncapsulate 

PLCCIt's EnglishPlastic Leaded Chip Carrier The abbreviation, that is, plastic sealJDrawing chip packaging.PLCCThe encapsulation method, the shape is square,32The feet are encapsulated, there are tube feet around, and the shape and size ratioDIPThe package is much smaller.PLCCPackage suitable for useSMTSurface installation technologyPCBThe upper installation wiring has the advantages of small shape and high reliability. 

4、 TQFPEncapsulate 

TQFPIt's Englishthin quad flat packageThe abbreviations are flat packaged in thin plastic sealing four corners.Follow -flat packaging (TQFP) The process can effectively use space, thereby reducing the requirements for the space of the printing circuit board.Due to the reduction of height and volume, this packaging process is very suitable for applications with higher space requirements, such asPCMCIA Card and network device.Almost allALTERAofCPLD/FPGAAllTQFP Package. 

5、 PQFPEncapsulate 

PQFPIt's EnglishPlastic Quad Flat PackageThe abbreviations are flat packaged in the four corners of the plastic seal.PQFPThe packaging of the packaging chip pin is small and the tube is very thin. Generally, large or large -scale integrated circuits are used in this packaging form. The number of pins is generally100above. 

6、 TSOPEncapsulate 

TSOPIt's EnglishThin Small Outline PackageThe abbreviations, the thin small size packaging.TSOPA typical feature of memory packaging technology is to make pins around the packaging chip.TSOPAppropriateSMTTechnology (surface installation technology)PCB(Print circuit board) Install wiring.TSOPWhen encapsulating shape size, parasitic parameters(When the current changes sharply, the output voltage disturbance is caused) Decreased, suitable for high -frequency applications, more convenient operation, high reliability.7、 BGAEncapsulate 

BGAIt's EnglishBall Grid Array PackageThe abbreviation, the ball array packaging.20century90With the advancement of technology, chip integration continues to improve,I/OThe number of pins has increased sharply, the power consumption has also increased, and the requirements for the packaging of integrated circuits are also stricter.To meet the needs of development,BGAThe packaging began to be applied to production. 

useBGAThe memory of the technical packaging can increase the memory capacity by two to three times when the internal volume is unchanged.BGAandTSOPCompared with a smaller volume, better heat dissipation and electrical performance.BGAThe packaging technology has greatly improved the storage of each square -inch, andBGAThe memory product of the packaging technology is only under the same capacity, and the volume is only availableTSOPOne -third of the package; in addition, and traditionTSOPCompared with the packaging method,BGAThe packaging method has a faster and effective way to heat dissipation. 

BGAEncapsulatedI/OThe terminal is distributed under the formation in the form of a circular or cylindrical solder point.BGAThe advantage of technology isI/OAlthough the number of pins has increased, the pink spacing has not decreaseBGACan be welded with controllable collapse chip method, which can improve its electrical performance; thickness and weight are reduced compared to previous packaging techniques; parasitic parameters are reduced, signal transmission is small, and the frequency of use is greatly improved;, High reliability. 

SayBGAYou can't help but mention the packageKingmaxCompany's patentTinyBGAtechnology,TinyBGAEnglish is all known asTiny Ball Grid Array(Small ball array packaging), it belongs toBGAA branch of packaging technology.yesKingmaxCompany in1998Year8If the monthly development is successful, the ratio of the chip area to the packaging area is not less than the1:1.14, Can increase the memory capacity when the existence is unchanged2～3Times, andTSOPCompared with the packaging products, it has a smaller volume, better heat dissipation performance and electrical performance. 

useTinyBGAThe memory products of the packaging technology are only in the same capacityTSOPEncapsulated1/3。TSOPThe pins of the packaging memory are led by the chip, andTinyBGAIt is caused by the center of the chip.This method effectively shortens the transmission distance of the signal, and the length of the signal transmission line is only traditionalTSOPTechnical1/4Therefore, the attenuation of the signal also decreases.This not only greatly improves the anti -interference and noise resistance of the chip, but also improves electrical performance.useTinyBGAPackaging chip can resist Gundam300MHzFrequency of the outside, and using traditionalTSOPThe highest packaging technology can only resist150MHzFrequency. 

TinyBGAThe thickness of the packaging memory is also thinner (the packaging height is less than0.8mm), The effective heat dissipation path from the metal substrate to the heat dissipation is only0.36mmEssencetherefore,TinyBGAMemory has higher thermal conductivity efficiency, which is very suitable for long -term operations and has better stability. 

three, Information on the package naming rules of some international brand products 

1、 MAXIM For more information, please refer towww.maxim-ic.com 

MAXIMPrefix isMAX。DALLASToDSbeginning. 

MAX×××orMAX×××× 

illustrate: 

1,suffixCSA、CWA inCExpress ordinary level,SExpress the table sticker,WIndicates wide -body table stickers. 

2,suffixCWIIndicates a wide -body table sticker,EEWIWide -body industrial -grade table sticker, suffixMJAor883For JUN level. 

3、CPA、BCPI、BCPP、CPP、CCPP、CPE、CPD、ACPAThe suffixes are generally dual -column. 

Give an exampleMAX202CPE、CPEordinaryECPEOrdinary anti -static protection 

MAX202EEPE Industrial -grade anti -static protection (-45℃-85℃）,illustrateERefers to anti -static protection protectionMAXIMDigital arrangement classification 

1Together2Font filter3Polymark multi -circuit switch 

4Word amplifier5Font digital modulus converter6Base -head voltage benchmark 

7Character -to -head voltage conversion8Font reset9Header comparator 

DALLASNaming rules 

For exampleDS1210N.S. DS1225Y-100IND 

N=IndustrialS=Width bodyMCG=DIPseal upZ=Width bodyMNG=DIPIndustrial 

IND=IndustrialQCG=PLCCseal upQ=QFP 

2、 ADI View more informationwww.analog.com 

ADProductAD、ADVMost, there areOPorREF、AMP、SMP、SSM、TMP、TMSWait at the beginning. 

Description of suffix: 

1In the suffixJExpress people's products (0-70℃），NIndicates ordinary plastic seal, with suffixes in the suffixRExpress the table sticker. 

2, Suffix in the suffixDorQExpressing pottery, industrial grade (45℃-85℃To.GermHIndicates a round hat. 

3In the suffixSDor883It belongs to jun product. 

For example:JN DIPEncapsulateJRTable stickerJD DIPSeal 

BBProduct naming rules: 

PrefixADSSimulation device suffixUTable stickerPyesDIPEncapsulateBIndicates industrial -grade prefixINA、XTR、PGAWait for high -precision op amp sufferersUTable stickerPrepresentDIP PAExpress high accuracy 

4、 INTEL View more informationwww.intel.com 

INTELProduct naming rules: 

N80C196The series are single -chip machine 

Prefix:N=PLCCEncapsulateT=IndustrialS=TQFPEncapsulateP=DIPEncapsulate 

KC20Main frequencyKBMain frequencyMCrepresent84Corner 

Example:TE28F640J3A-120 flash memoryTE=TSOP DA=SSOP E=TSOP 

5、 ISSI View more informationwww.issi.com 

byISbeginning 

for example:IS61C IS61LV 4×expressDRAM 6×expressSRAM 9×expressEEPROM 

Packaging: PL=PLCC PQ=PQFP T=TSOP TQ=TQFP 

6、 LINEAR View more informationwww.linear-tech.com 

Use the product name as a dyent 

LTC1051CS CSRepresent the table sticker 

LTC1051CN8 **express*IPEncapsulate8foot 

7、 IDT View more informationwww.idt.com 

IDTThe products are generallyIDTStarting 

Description of suffix: 

1In the suffixTP  Narrow bodyDIP 

2In the suffixPWide bodyDIP 

3In the suffixJSubordinatePLCC 

for example:IDT7134SA55P yesDIPEncapsulate 

IDT7132SA55J yesPLCC 

IDT7206L25TP yesDIP 

8、 NS View more informationwww.national.com 

NSThe product partLM 、LFStarting 

LM324N 3Words represent the civilian product beltNRound hat 

LM224N 2Words represent industrial -grade beltJSeal 

LM124J 1The prefix represents the Jun product beltNPlastic seal 

Packaging: DPrepresentDIPEncapsulateDGrepresentSOPEncapsulateDTrepresentTSOPPackage.

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