Advanced packaging capacity in 2024 is expected to increase by 30 % to 40 %

According to the TrendForce Ji State Consultation Research, in 2023, Chatbot and other generation AI applications have driven the growth boom of AI servers, and they are the most active investment in large cloud operators.AI server to continuously train and optimize its AI analysis model.

The high-end AI chip that needs to be used in high-end AI servers will push the demand for high-band wide memory (HBM) in 2023-2024, and will grow driving advanced packaging capacity by 30-4 % in 2024.

TRENDFORCE Jibang Consulting pointed out that in order to improve the system computing efficiency of the overall AI server, as well as memory transmission bandwidth, most of the high -end AI chips such as NVIDIA, AMD, and Intel choose HBM.At present, the A100 and H100 of NVIDIA, each equipped with HBM2E and HBM3 with 80GB of HBM2E and HBM3. In its latest integration of the Grace Hopper chip of the CPU and GPU, the single chip HBM has an increase of 20%to 96GB.In addition, AMD's MI300 is also equipped with HBM3. Among them, the MI300A capacity is the same as 128GB as the previous generation, and the higher -end MI300X reaches 192GB, an increase of 50%.At the same time, it is expected that Google will actively expand in the second half of 2023 to cooperate with Broadcom to develop the AISC AI acceleration chip TPU, which is also equipped with HBM memory to expand AI infrastructure.

TRENDFORCE Jibang Consulting estimates that in 2023, the market is mainly equipped with HBM AI acceleration chips (such as NVIDIA's H100 and A100, AMD's MI200, MI300, and Google TPU, etc.). The total HBM capacity will reach 290 million GB, the growth rate will beNearly 60 %, will continue to grow by more than 30 % in 2024.

In addition, the demand for advanced packaging technology such as AI and HPCs has increased. Among them, TSMC's COWOS is the main use of AI server chips.COWOS packaging technology is mainly divided into two sections of COW and OS. Among them, COW mainly integrates various logic ICs (such as CPU, GPU, AISC, etc.) and HBM memory.Wait for the joint, encapsulate on the substrate, and finally integrate it to the PCBA, becoming the main computing unit of the server motherboard, forming a complete AI server system with other components such as network, storage, power supply unit (PSU) and other I/O.Essence

TrendForce Ji State Consultation Observation, under the strong demand of high -end AI chips and HBM, TSMC's monthly production capacity at the end of 2023 is expected to reach 12K. Among them, NVIDIA is driven by related AI Server such as A100 and H100.It is estimated that it will increase by nearly 50 %, plus the growth of high -end AI chips such as AMD and Google, which will make the COWOS production capacity in the second half of the year, and this strong demand will continue to 2024. It is estimated that if the relevant equipment is available, advanced packagingThe capacity will grow by 3-4 %.

TrendForce Ji State Consultation pointed out that it is worth noting that under the rapid demand of AI, whether it is the production process of HBM or Cowos, you can follow the supporting measures of surroundings, such as Silicon Pole Packaging Technology (TSV), Interposer (Interposer) And whether related equipment (such as wet process equipment) can be in place, such as the consideration of the front time.With the continuous demand for AI, it is estimated that NVIDIA is on the COWOS -related process, and it does not rule out that other similar packaging foreign aids, such as AMKOR or Samsung, will be evaluated to deal with possible situations.

About Sanquan Technology
Shenzhen Sanquan Asia -Pacific Technology Co., Ltd. was established in 2000. It is an IC agent of Asian integrated circuits. It has more than 200 agent distribution product lines and is selected by many customers. It is reliable supplier of integrated circuit ICs and electronic components.Sanquan Technology Supply HBM's three major memory manufacturers in the world, SK Hynix, Micron and Samsung.The excellent domestic Yangtze River storage is also its customers.It can be seen from this that Sanquan Technology's product competitiveness.In addition, the brands of Sanquan Technology's agency distribution include Richtek, ON, Microchip, TI and so on.