TSMC's "small chip" back end FAB is opened, with an annual output of over 1 million tablets 300mm wafers

The wafer fab is located in Zhunan Science Park, Miaoli County, northern Taiwan. The base area reaches 14.3 hectares. It is the advanced lattocular wafer fab that TSMC.

TSMC announced its ADVANCED BACKEND (advanced back -end) wafer fab Fab 6 to open it. This is the company's first one -piece automation advanced package and testing wafer factory to achieve 3D Fabric integration.) And multi -chip assembly method.

Some industry observers believe that this is because the AI GPU has been in short supply in recent months, and COWOS with limited production capacity has been too late to adapt, so that TSMC prioritizes the planning of advanced packaging.

Advanced Backend Fab 6 preparations for mass production TSMC-SOIC (integrated chip system) process technology, which will enable TSMC to distribute production capacityAnd efficiency.

Advanced Backend Fab 6 started construction in 2020 to support the next generation of HPC, AI, mobile applications and other products.

The wafer plant is located in Zhunan Science Park, Miaoli County, northern Taiwan. The base area reaches 14.3 hectares. It is TSMC so far.The large advanced rear road wafer fab, the dust -free room area is larger than the sum of other advanced lattice wafers in TSMC.

TSMC increased the degree of automation in the plant, and the automatic material handling system in the factory was more than 32 kilometers in length.From WAFER to DIE, the production information and agile scheduling systems are opened to shorten the production cycle.These systems are combined with artificial intelligence, while accurate process control, real -time detection abnormalities, and establishing a powerful chip -level big data quality defense network.The data processing capacity per second is 500 times that of the front wafer fab, and builds the complete production history of each DIE through Die Traceability.

TSMC estimates that the Advanced Backend Fab 6 will have the ability to produce more than 1 million tablets of 300mm wafer equivalent 3D FABRIC process technology each year, as well as testing services that exceed 10 million hours per year.

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