International Consumer Electronics Show CES exhibition on January 9 will be launched in Las Vegas, Taiwan digital imaging program expert Hua Jingke will be released at the CES show the latest 3D sensing depth chip AL6100, hoping to borrow by The world's largest science and technology exhibition so that the world see Huajing Branch of the technical strength and products.

iPhone X to give up fingerprinting Face ID gradually gaining market acceptance, so that non-Apple camp phone factory also accelerated layout, according to vendor vendors revealed that Huawei, OPPO, millet and other brand manufacturers have embraced 3D sensor technology. It is foreseeable that with the 3D sensing technology market continues to open, 2018 will launch a new machine with 3D sensor capabilities will spring up, the fingerprint recognition application under the screen may face crowding-out effect.