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5g Chip Helio M70 Is Expected To Appear In 2019Source:laoyaoba.com Release Date:2018/6/7 Click On:4206
The Helio M70 Modem chip solution, announced on 5, has been decided to be shipped formally in 2019. This new generation of Modem chip products will be announced and produced almost half a year, in addition to a more complete layout and consistency in the 5G communications technology. In addition, the 5G market and application opportunities have begun to ferment.
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Amd Is Experimenting With 7nm Chip Vega 20, Which Is Expected To Come Out By The End Of The YearSource:laoyaoba.com Release Date:2018/4/28 Click On:5051
AMD recently announced their 2018 quarter earnings report, which has increased significantly over the same period last year. Revenue rose from $1 billion 180 million to $1 billion 650 million, an increase of 40%; profits soared from 11 million to $120 million, an increase of 990%. AMD has three business divisions: computing and graphics, enterprise / embedded / semi custom, and others. There is no suspense that the growth of performance has benefited from the strong pull of Ryzen and EPYC product lines, and the surge in demand for video cards by encrypting money for mining.
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In The Ai Field, Global Semiconductor Output Is Expected To Grow By 10% This YearSource:laoyaoba.com Release Date:2018/4/18 Click On:5321
Gathering micro-messages, according to a Taiwan media report, at the VLSI-TSA and VLSI-DAT seminars held by today's VLSI-DAT, memory makers Lu Chaoqun said that due to strong market demand, he is optimistic about the semiconductor industry's economic outlook this (2018) year. It is expected that the global semiconductor output value this year is expected to grow by another 10% compared with (2017), which will be higher than the industry’s previous expectations of 7 %.
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Amd Zen 5 Architecture Design Expected To Be Available After 2021, Or Using 5nm ProcessSource:laoyaoba.com Release Date:2018/4/13 Click On:5508
Although AMD has announced the short-range processor architecture development blueprint only to the Zen 3 design that is expected to be launched in 2020, and determined that it will be mass-produced in an optimized 7-nm...
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Boe 6.3 Billion Debt Exemption By The Government Is Expected To Increase Profits This Year 900 Million YuanSource: Release Date:2018/1/17 Click On:3791
On the evening of January 16, BOE A announced that it has recently signed the Debt Exemption Agreement with Fuzhou Chengtou BOE Investment Co., Ltd., Fuzhou Urban Construction Investment Group and Fuzhou Municipal People's Government on the "Fuzhou 8.5th Generation New Semiconductor Display Device Production Line Project Investment Framework Agreement" , Exempting companies from using the loans for the project totaling 6.3 billion yuan.
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