Recently, MediaTek announced that it will acquire Intel’s Enpirion power management chip product line through its subsidiary Richtek, with an estimated total transaction value of approximately US$85 million (approximatel...

The impact of wafer shortages is increasing. The power semiconductor industry currently has an average growth rate of 10%, and some products have even higher growth rates.The reporter learned from a number of companies i...

With the continuous penetration of the Internet of things, the Internet of everything is gradually becoming a reality. In our daily life, all kinds of smart home devices can be connected To the same network, and the tren...

Infineon technologies inc. for its 1200 V TRENCHSTOP? IGBT7 series introduces a new current rating module. This makes the Easy 1B and 2B product families even more complete, and it is now possible to combine the latest c...

Powerchip Group4Day heldComputing in MemoryIntegrated Technology Platform Press Conference，And published the world's first revolutionary architectureAIM。Founder Huang Chongren said，AIMIs promotion20Double the computing p...

Highly integrated power management、Charging、AC/DC the power conversion、Wi-FiAnd Bluetooth low energy technology vendorsDialogSemiconductor company(German stock exchange trading code：DLG)Announced today，It is the smallest...

According to Jiwei. com, a ghost incident broke out in Basf, a global maximization industry company. Huang Senior Manager and Lin retired factory director were suspected of colluding with their competitors. At the cost o...

IBM signed an agreement with Samsung Wafer Factory to use Samsung's 7-nanometer EUVL process to manufacture its next-generation processors, which will be used for IBM Power Systems, IBM Z and Linux ONE Systems. IBM's for...

Following the release of the world's first 5G mobile phone chip "Qiaolong 855" by Qualcomm, a global chip manufacturer, on July 7th, Taiwan's Unified Development Section officially released its first 5G multi-mode integr...

According to a survey conducted by Taiwan research institutes, 5G high frequency communication chip packaging is expected to develop towards AiP technology and fan-out packaging technology in the future. It is expected t...