Keyssa, a leader in contactless connectivity solutions, today introduced the KSS104M, a new generation of component connector products, in an ultra-compact 3 x 3mm package with improved electrical and mechanical tolerances for easier design, significantly reduced power consumption and support High-speed communication protocol for industry standards. Keyssa also publishes KSS104M-CW (Connected World), which is a ready-to-use non-contact connection module that includes all the electromagnetic and mechanical requirements of critical systems, enabling the KSS104M to be built into mobile devices and other system products.

Memory plant Winbond successfully into the Apple iPhone 8 supply chain. According to Apple supply chain industry, said Winbond exclusive supply of NOR Flash products, and Samsung AMOLED panel together into a mobile phone panel module, in August began heavy volume shipments, and applied in the Apple iPhone 8 products, on behalf of China Bang electric operation will be expected to flourish to the first half of next year.

Qorvo, Inc., a provider of innovative RF solutions for the interconnected world, today announced the industry's smallest sound wave (BAW) filter, the QPQ1300, which handles an average 5W RF input power with a peak power of 40W.

Toshiba Semiconductor and Storage Products announced two new "TC3567CFSG" and "TC3567DFSG" leading industry [1] to achieve lower current consumption than the plateau [2] and enhance the safety communication function. These two ICs are Toshiba's latest members of Bluetooth-enabled low power (LE) [3] ver.4.2 communication chips. The sample is available.