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Samsung Electro-Mechanics Plans To Set Up An MLCC Embedded Substrate Production Line In Vietnam To Expand AI Packaging Production CapacitySource:爱集微 Release Date:2026/4/15 Click On:438
As AI chips have increasingly higher requirements for performance and integration, advanced packaging and substrate technologies have become crucial in semiconductor competition.Samsung Electro-Mechanics is reportedly bu...
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Total Investment Is 20 Billion Yuan!Xiamen Silan Microelectronics 12-Inch Chip Production Line Project Signed And ImplementedSource:casmita Release Date:2025/10/20 Click On:1295
On October 18, the Xiamen Municipal Peoples Government, the Xiamen Haicang District Peoples Government, and Hangzhou Silan Microelectronics Co., Ltd. signed the Strategic Cooperation Agreement on the 12-inch High-end Ana...
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The production capacity of mature mainland China accounts for about 29%. It is estimated that 2027 will be expanded to 33%Source: Release Date:2024/1/5 Click On:69
according toTrendForce Ji State Consultation Statistics, 2023 ~ 2027 Global Workers' mature process (28nm and above) and advanced processes (16nm and below) have remained at about 7: 3.Due to the efforts to promote local...
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About the common sense of packaging of IC productsSource: Release Date:2024/1/5 Click On:67
closeICCommon sense of product packagingone, What is packagingPackaging means to pipe the circuit foot on the silicon wafer,Use a wire to attract to the external connector,In order to connect to other devices.The form of...
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SMIC announced: Stopping the production of 28nm chipSource: Release Date:2024/1/5 Click On:57
SMIC has abandoned 28 nanometer chips, foreign media:Chinese chipThe company is going to rise!This year, the elder brother of the Chinese chip industry suddenly announced a news that shocked the world: they want to give...
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Aixin Yuanzhi Released The New Generation Of IPC Soc Chip AX630C And AX620QSource: Release Date:2023/10/27 Click On:2487
AI visual chip research and development and basic computing power platform company Aixin Yuanzhi announced that it has released the new generation of IPC SoC chip products AX630C and AX620Q, which has attracted attention...
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The High -End Industrial Market For Heavy New Products, Zhaoyi's Innovative Layout Of Green Energy "Core" ApplicationSource: Release Date:2023/8/9 Click On:2630
Entering 2023, the industrial chain of the industrial control market in the background of Industrial 4.0 fully exerted its efforts to continuously accelerate the introduction of industrial manufacturing in the direction...
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Ruisa Electronics MCU And MPU Product Line Will Support Microsoft Visual Studio CodeSource: Release Date:2023/8/1 Click On:2943
Global Semiconductor Solutions Supplier Ruisa Electronics (TSE: 6723) today announced that its customers can now use Microsoft NBSP; Visual Studio Code (VS Code) to develop Risas full series microcontroller (MCU) and mi...
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Da Lian Dajia Group Launched The TWS Headset Solution Based On Dafa Technology ProductsSource: Release Date:2023/7/19 Click On:2903
International leading semiconductor component distributor dedicated to the Asia -Pacific market--- Da Lianda Holdings announced that its underworldPinjia launchedTWS headset solution for ARIOHA AB1565 chip.Figure 1-Da Li...
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The Shipment Volume From January To April Was 134%Year-On-Year, And The Production Capacity Of MLCC Suppliers Was Reduced In The Short TermSource: Release Date:2023/5/19 Click On:2403
According to statistics from TrendForce Ji State Consultation, the total shipments of MLCC suppliers from January to April this year were 1359 billion, a decrease of 34%compared with the same period of 2021, showing that...
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