Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.

This week, according to the Yonhap news agency, Samsung Electronics announced that it has started using the second-generation 10nm process to produce 8Gb DDR4 particles, another iteration of technology after two years of the first-generation 10nm process.

KLA-Tencor announces the launch of the new FlashScan ™ blank mask * detection product line. Since the launch of the first inspection system in 1978, KLA-Tencor has been a major supplier of pattern mask inspection, and the new FlashScan product line has announced that the company has entered a dedicated blank mask inspection market.

With Huawei Mate 10 will be released in mid-October news, this new machine equipped with the Kirin 970 processor, naturally became a lot of people concerned about the topic.

The solution includes a support for 20 links, multi-role, Bluetooth 5 certified S132 v5.0 protocol stack, in all role combinations to provide full-link concurrent.

Silicon Labs (also known as "Core Technology") has launched the industry's most scalable, flexible and cost-effective car radio solution for the global automotive infotainment market.

Bourns, a leading global supplier of electronic components, announced the addition of a new force to its award-winning Multifuse products - AEC-Q200 certified high temperature polymer polymer positive temperature coefficient (PPTC) self-healing fuse.

Silicon Labs (also known as "Core Technology") has introduced a new multi-band SoC that supports full Bluetooth 5 connectivity and more storage capacity options to further expand its Wireless Gecko system single-chip (SoC) product line.

On the morning of June 13, the total investment of 35 billion yuan Wuhan Huaxing photoelectric 6th generation flexible LTPS-AMOLED production line (Huaxing photoelectric t4 project), in the optical Valley intelligent manufacturing industry park started.

Today announced the availability of its 7nm lead performance (7LP) FinFET semiconductor technology, with 40% of the leapfrog performance boost to meet the needs of applications such as high-end mobile processors, cloud servers and network infrastructures. Design Suite is now ready, based on 7LP technology, the first batch of customer products is expected to launch in the first half of 2018, and will be the second half of 2018 to achieve mass production.